Building Resilient Semiconductor Supply Chains

Building competitive and resilient value chains through the comprehensive heterogeneous integration of partners involved in the packaging technology. The semiconductor industry’s complex inbound supply chain comprises 1000 processing steps and crosses over seventy borders.

Developing concepts, semantic data models and services for intercompany data exchange in network nodes and the integration of data from and services for factory and supply chain assets in the dataspace.

Developing the methodology for storing the life cycle assessment data sets in semantic submodels of the digital twin. Optimizations of the digital twin using machine learning and statistical mathematics.